Wafer Level Chip Scale Package(WLCSP)
- Bumped Wafer Probing
-
Back Grinding Wafer taping
Machine http://www.lintec-usa.com/products-bg.cfm -
Wafer Back-Grinding
-
Back Grinding Wafer Detaping
Machine http://www.lintec-usa.com/products-bg.cfm -
Wafer mounting on Film Frame
Machine http://www.longhill-ind.com/ -
UV Cure
-
Dicing Saw
Machine http://www.disco.co.jp/eg/products/dicer/index.html -
AOI
Machine http://www.rudolphtech.com/ -
VM
-
Packaging and shipping
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