Wafer Level Chip Scale Package(WLCSP)
-
Bumped Wafer Probing
-
Back Grinding Wafer taping
Machine http://www.lintec-usa.com/products-bg.cfm -
Wafer Back-Grinding
-
Back Grinding Wafer Detaping
Machine http://www.lintec-usa.com/products-bg.cfm -
Wafer mounting on Film Frame
Machine http://www.longhill-ind.com/ -
UV Cure
-
Diecing Saw
Machine http://www.disco.co.jp/eg/products/dicer/index.html -
AOI
Machine http://www.rudolphtech.com/ -
VM
-
Packaging and shipping
| < Prev | Next > |
|---|
Newer news items:
- 17/02/2009 10:34 - Simple Cell Phone Jammer
- 15/02/2009 21:57 - Class-T Digital Audio Amplifier
